Chemically Amplified Photosensitive Poly(benzoxazole)
Chemically Amplified Photosensitive Poly(benzoxazole)
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化学放大型光敏聚苯并恶唑
DOI：
10.2494/photopolymer.16.287
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发表时间：
2003
影响因子：
0.8
通讯作者：
M. Ueda
中科院分区：
文献类型：
--
作者：
K. Ebara;Y. Shibasaki;M. Ueda
以聚邻羟基酰胺（t-BOC）为原料，以二苯基碘鎓盐（DIAS）为光生酸剂，合成了一种新型的化学放大光敏聚苯并恶唑（PBO）前驱体。当将抗蚀剂暴露于365 nm光，随后在120°C下后烘烤5分钟并在25°C下用2.38重量%四甲基氢氧化铵（TMAH）水溶液显影时，抗蚀剂显示出60 mJ cm-2的灵敏度和2.5的对比度。在100 mJ cm ~（-2）365 nm紫外光照射下，用接触方式曝光，可得到10μm的线状和间隔状的正像。通过在350°C下热处理1小时，该正像给出了交联的PBO，其保持其原始形状，这表明在热处理期间具有高耐久性。
A novel chemically amplified photosensitive poly (benzoxazole) (PBO) precursor based on partially tert-buthoxycarbonylated (t-BOC) poly (o-hydroxyamide) having norbornene end-capping groups 5 and diphenyliodonium-9, 10-dimethoxyantracene-2-sulfonate (DIAS) as a photo-acid generator has been developed. The resist showed a sensitivity of 60 mJ cm-2 and a contrast of 2.5 when it was exposed to 365 nm light, followed by post-baking at 120°C for 5min and developing with 2.38 wt% aqueous tetramethylammonium hydroxide (TMAH) solution at 25°C. A fine positive image featuring 10μm line and space patterns was obtained on the film exposed to 100 mJ cm-2 of UV-light at 365 nm by the contact mode. By heat treatment at 350°C for 1h, this positive image gave the cross-linked PBO retaining its original shape that indicated high durability during thermal process.