Photoelastic analysis of matrix stresses around a high modulus sapphire fibre by means of phase-stepping automated polariscope
Photoelastic analysis of matrix stresses around a high modulus sapphire fibre by means of phase-stepping automated polariscope
复制标题
通过相位步进自动偏光镜对高模量蓝宝石光纤周围的基体应力进行光弹性分析
DOI：
10.1016/j.compositesa.2004.06.033
复制
发表时间：
2005
影响因子：
8.7
通讯作者：
F. Jones
中科院分区：
文献类型：
--
作者：
F. Zhao;R. Martin;S. Hayes;E. Patterson;R. Young;F. Jones
基体应力场已被量化，并已使用相位步进光弹性和荧光光谱研究了蓝宝石纤维在环氧树脂基体中的破碎的微观力学。等值线条纹顺序（有关的主应力的差异）的等高线图已被用来详细描述在应力传递过程中的基质裂纹和界面脱粘的存在下，在基质应力场的变化。在不同的基体应力水平下的界面剪应力分布清楚地表明了界面脱粘的程度。结果表明，基体裂纹显著降低了界面处的应力传递效率。实验发现，在LY 5052/HY 5052环氧树脂体系中埋入蓝宝石光纤的脱粘界面处的摩擦剪切应力为3- 10 MPa。讨论了界面剪应力与轴向纤维应力的关系。从光弹性得到的界面剪切应力分布进行了比较，从轴向纤维应力的荧光光谱带的位移测量计算。
The matrix stress field has been quantified and the micromechanics of fragmentation of sapphire fibres in an epoxy matrix have been investigated using phase-stepping photoelasticity and fluorescence spectroscopy. Contour maps of the isochromatic fringe order (related to the difference in principal stresses) have been used to describe in detail the changes in matrix stress field during stress transfer in the presence of a matrix crack and interfacial debonding. The profiles of interfacial shear stress at various levels of applied matrix stress indicate clearly the extent of interfacial debonding. The results show that the matrix crack significantly reduces the efficiency of stress transfer at the interface. The frictional shear stress at the debonded interface has been found experimentally to be 3–10MPa for a sapphire fibre embedded in the LY5052/HY5052 epoxy system. The relationship between interfacial shear stress and axial fibre stress is discussed. The interfacial shear stress profiles obtained from photoelasticity has been compared to that calculated from the axial fibre stress measured by shifts in fluorescence spectral bands.