Study on thermal stability and irradiation response of copper/iron nano-multilayer composite fabricated by cross accumulative roll bonding

Study on thermal stability and irradiation response of copper/iron nano-multilayer composite fabricated by cross accumulative roll bonding
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DOI:
10.1016/j.jnucmat.2020.152548
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发表时间:
2021
影响因子:
3.1
通讯作者:
Liqing Zhang;R. Gao;J. Hou;Bang-Lei Zhao;M. Sun;T. Hao;Z. Xie;R. Liu;Xuejiang Wang;Fang Qianfeng-;Changsong Liu
Liqing Zhang;R. Gao;J. Hou;Bang-Lei Zhao;M. Sun;T. Hao;Z. Xie;R. Liu;Xuejiang Wang;Fang Qianfeng-;Changsong Liu
中科院分区:
工程技术2区
文献类型:
--
作者:
Liqing Zhang;R. Gao;J. Hou;Bang-Lei Zhao;M. Sun;T. Hao;Z. Xie;R. Liu;Xuejiang Wang;Fang Qianfeng-;Changsong Liu

文献摘要

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纳米多层复合材料由于界面密度大,同时具有高强度和良好的耐辐射性能。然而,这些优异的性能受到其热稳定性的影响。在这项研究中,我们研究了交叉累积叠轧复合(CARB)制备的Cu/Fe复合材料的组织和硬度的演变与不同的单层厚度和退火时间。结果表明,层厚为90 nm的复合材料更耐层间夹断和球化,且在400 °C长时间退火后仍保持较高的强度。相比之下,降低Cu/Fe界面密度和严重的晶粒球化在30 nm的样品导致硬度显着下降。此外,对于500 °C下90 nm Cu/Fe复合材料的氦辐照响应,在Cu/Fe界面处出现了一些具有大纵横比的柱状空洞,表明空洞在界面法向的延伸需要同时满足动力学(沿着空位通量)和热力学(沿着{111}面)因素。另外,Cu/Fe多层膜中气泡尺寸的明显增大是高温辐照后膜层硬化的主要原因。
Nano-multilayer composites simultaneously exhibit high strength and good radiation resistance because of its huge density of interfaces. However, such outstanding behaviors are influenced by their thermal stability. In this study, we investigated the evolution of microstructure and hardness in Cu/Fe composites fabricated by cross accumulative roll bonding (CARB) with different individual layer thicknesses and annealing time. The results demonstrated that the composites with a layer thickness of 90 nm are more resistant to layer pinch-off and spheroidization, and maintain a relatively high strength after the long-time annealing at 400 °C. By contrast, the decreasing Cu/Fe interface density and severe grain spheroidization in the 30 nm sample lead to a significant drop in hardness. Furthermore, as for helium irradiation response in the 90 nm Cu/Fe composite at 500 °C, some columnar voids with a large aspect ratio appear at Cu/Fe interfaces, demonstrating that void elongation in the normal direction of the interface requires to satisfy both kinetic (along vacancy flux) and thermodynamic (along {111} plane) factors. In addition, the obviously increasing bubble size mainly contributes to the hardening in Cu/Fe multilayers after high-temperature irradiation.