Optical emission characteristics of ablation plasma plumes during the laser-etching process of CdTe
Optical emission characteristics of ablation plasma plumes during the laser-etching process of CdTe
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DOI：
10.1007/s11664-005-0201-7
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发表时间：
2005-11-01
影响因子：
2.1
通讯作者：
Yasuda, K
中科院分区：
文献类型：
--
作者：
Abe, K;Eryu, O;Yasuda, K
报道了激光刻蚀CdTe过程中的光发射和表面成分变化。蚀刻速率与激光能量密度成比例地增加。然而，由于通过以高于0.4J/cm（2）的能量密度照射激光而产生的烧蚀等离子体羽流屏蔽了激光束，因此抑制了蚀刻速率的增加。在1.0 J/cm（2）的能量密度下的蚀刻速率已被确定为91 nm/脉冲。此外，80 μ m深和55 μ m宽的沟槽已形成与激光蚀刻工艺。
Optical emission and surface compositional change during the laser-etching process of CdTe are reported. The etching rate increases in proportion to the laser energy density. However, the increase in etching rate is suppressed because ablation plasma plumes generated by the laser irradiation at the energy densities above 0.4 J/cm(2) shield the laser beam. The etching rate at the energy density of 1.0 J/cm(2) has been determined to be 91 nm/pulse. Also, 80-mu m-deep and 55-mu m-wide trenches have been formed with the laser-etching process.