Research Progress and Application Prospect in Radar of Cu-C Composites
Research Progress and Application Prospect in Radar of Cu-C Composites
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发表时间：
2014
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通讯作者：
Wang Chang-ru
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作者：
Wang Chang-ru
由于具有改善的机械性能、增强的导电性和热稳定性，Cu-C复合材料是一种很有前途的功能材料，可用作电气封装、电子元件、散热基板和散热器。采用表面化学处理和机械合金化方法，改善Cu与C之间的润湿性，增强界面结合强度。通过常压烧结、热压烧结、火花等离子烧结、热挤压等工艺，获得成分良好、组织均匀、致密化的块状Cu-C复合材料。可为雷达高散热电子元件的设计和应用提供参考。
Due to improved mechanical properties,enhanced conductivities and thermal stability,Cu-C composites are promising functional materials used as electrical packing,electronic components,heat-spreading substrates and heat sinks. Surface chemical treatment and mechanical alloying methods are used to ameliorate the wettability and enhance the interfacial bonding strength between Cu and C. Bulk Cu-C composites with good constituent,microstructural homogeneity and full densification are acquired by pressureless sintering, hot-pressed sintering,spark plasma sintering,hot-extrusion and so on. It can provide a reference for the design and application of highly heat-dissipating electronic components for the radar.