Influence of Light Intensification by Subsurface Cracks on KH2PO4 Crystal's Laser Induced Damage Threshold
Influence of Light Intensification by Subsurface Cracks on KH2PO4 Crystal's Laser Induced Damage Threshold
复制标题
次表面裂纹光强对KH2PO4晶体激光损伤阈值的影响
DOI：
10.7567/jjap.52.032701
复制
发表时间：
2013-03-01
影响因子：
1.5
通讯作者：
Jiang, Wei
中科院分区：
文献类型：
--
作者：
Chen, Mingjun;Li, Mingquan;Jiang, Wei
单点金刚石车削（SPDT）引起的亚表面损伤是导致KDP晶体激光损伤阈值（LIDT）降低的重要前兆。基于傅立叶模型理论，分析了亚表面裂纹的调制特性。研究结果表明，亚表面裂纹的光增强作用是KDP失效的重要机制。在一定的切削深度下，随着进给速度的增加，亚表层损伤深度与LIDT呈相反的变化趋势。即通过选择合适的切削参数来获得较小的损伤深度，也将有利于提高KDP晶体的表面损伤阈值。在给定的主轴转速和刀具几何尺寸下，进给量和切削深度的组合共同决定了损伤深度。当切削深度较大时，小进给量有利于提高激光诱导成形深度，而当切削深度较小时，情况则相反。
The subsurface damage introduced by single point diamond turning (SPDT) is an important precursor that decrease the laser induced damage threshold (LIDT) of KH2PO4 (KDP) crystal. In this paper, based on the Fourier model theory, the modulation property of subsurface crack is analyzed. Research results indicate that light intensification by subsurface crack is an important mechanism of KDP failure. When the feed speed increases under the certain cutting depth, the subsurface damage depth and LIDT have the inverse changing trend. Namely that the intention of obtaining smaller damage depth by choosing suitable cutting parameters, will be also beneficial to improve the surface LIDT of KDP crystal. The combination of feed and cutting depth decides the damage depth together under the given spindle speed and tool geometry. The small feed is beneficial for improving the LIDT when cutting depth is large, while the situation is opposite when cutting depth is small.