A low temperature and air- sinterable copper- diamine complex- based metal organic decomposition ink for printed electronics
A low temperature and air- sinterable copper- diamine complex- based metal organic decomposition ink for printed electronics
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用于印刷电子产品的低温空气烧结铜二胺络合物基金属有机分解油墨
DOI：
10.1039/c8tc01849a
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发表时间：
2018-06-28
影响因子：
6.4
通讯作者：
Sun, Xudong
中科院分区：
文献类型：
--
作者：
Dong, Yue;Lin, Zhijie;Sun, Xudong
导电铜图案通常在真空、惰性气体或还原性气氛中加热，以避免印刷电子应用中铜的氧化。在这里，我们报告了一种金属有机分解铜油墨的配方，并通过在空气中在低温下加热油墨获得导电铜膜，使用二胺作为络合剂，没有其他添加剂。二胺与四水合甲酸铜前体的络合降低了油墨的热分解温度，促进了膜的致密化，并防止了铜在加热过程中通过消耗吸收的氧而氧化。使用1，2-二氨基丙烷作为络合剂的铜膜在空气中在180 ℃下加热1分钟后显示出1.8 × 10（-5）cm的低电阻率。笔写铜图案显示出金属铜光泽和在PI基板上的良好附着力。
Conductive copper patterns are usually heated in vacuum, inert gas or reducing atmosphere to avoid the oxidation of copper for printed electronics applications. Here, we report a formulation of metal organic decomposition copper ink and obtained conductive copper films by heating the ink in air at low temperatures using diamine as the complexing agent without other additions. The complexing of diamine with the copper formate tetrahydrate precursor lowers the thermal decomposition temperature of the ink, promotes the densification of the film and prevents the oxidation of copper by consuming absorbed oxygen during the heating process. The copper films using 1,2-diaminopropane as the complexing agent showed a low resistivity of 1.8 x 10(-5) cm after heating at 180 degrees C for 1 min in air. The pen-writing copper patterns showed a metal copper luster and great adhesion on a PI substrate.