Practical utilization of low melting alloy thermal interface materials
Practical utilization of low melting alloy thermal interface materials
复制标题
低熔点合金热界面材料的实用化
DOI：
--
复制
发表时间：
2006
期刊：
影响因子：
--
通讯作者：
J.L. Strader
中科院分区：
文献类型：
--
作者：
R. F. Hill;J.L. Strader
低熔点合金热界面材料的使用导致发热电子部件和排热系统之间的热阻非常低。在某些条件下，这些合金可能氧化，这可能导致热性能的劣化。此外，如果在熔融状态下使用合金，则存在由于逸出金属而导致的电短路的可能性。氧化和电短路被证明是通过各种设计参数最小化。这些措施包括使用在界面区域周围形成密封的超大金属合金TIM;将低熔点合金直接焊接到排热部件;使用垫圈来提供屏障以防止空气进入界面区域并用作过量熔融合金的收集载体;以及在“老化”循环之后在低于合金熔点的温度下操作。低熔点合金的使用，结合一系列的设计准则，提供了一个热解决方案，提高了可靠性和极低的热阻
The use of low melting alloy thermal interface materials results in exceptionally low thermal resistance between heat-generating electronic components and heat removal systems. Under certain conditions, these alloys can oxidize which may lead to degradation in thermal performance. In addition, if the alloy is used in the molten state, there is a possibility of electrical shorts resulting from escaping metal. Oxidation and electrical shorts are shown to be minimized through a variety of design parameters. These include the use of oversized metal alloy TIM's that form a seal around the interface area; soldering the low melting alloys directly to the heat removal component; use of a gasket to provide a barrier to prevent air from entering the interface area and to serve as a collection vehicle for excess molten alloy; and operating below the melting point of the alloy after a "burn-in" cycle. The use of low melting alloys, in conjunction with a series of design guidelines, provides a thermal solution with improved reliability and exceptionally low thermal resistance