Strain rate sensitive stretchability and fracture behavior of nanocrystalline Cu films on flexible substrate
Strain rate sensitive stretchability and fracture behavior of nanocrystalline Cu films on flexible substrate
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DOI：
10.1016/j.msea.2012.01.006
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发表时间：
2012-02
期刊：
影响因子：
6.4
通讯作者：
Z. Cao;K. Hu;X. Meng
中科院分区：
文献类型：
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作者：
Z. Cao;K. Hu;X. Meng
通过单轴拉伸实验研究了聚合物支撑铜膜的拉伸性能和断裂行为。薄膜的裂纹间距不仅与应变速率有关，而且与薄膜的厚度有关。在高应变率下，厚膜比薄膜更容易产生平行于加载方向的裂纹。分层和裂纹沿着加载方向相互促进，加速了薄膜的失效。计算的能量释放率随应变速率的增加而减小，可以用来解释薄膜/基体的断裂行为。
The strain rate dependent stretchability and fracture behavior of the polymer-supported Cu films was studied by uniaxial tension test. The crack spacing of the films is dependent not only upon the strain rate but also the thickness of the films. At a high strain rate, cracks parallel to loading direction are found to occur more easily in thicker film than thinner one. Delamination and crack along loading direct facilitate each other, accelerating the failure of films. The calculated energy release rate decreases with increasing strain rate, which can be used to explain fracture behavior of film/substrate.