Flexible polymer substrate and tungsten microelectrode array for an implantable neural recording system.
Flexible polymer substrate and tungsten microelectrode array for an implantable neural recording system.
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用于植入式神经记录系统的柔性聚合物基板和钨微电极阵列。
DOI：
10.1109/iembs.2008.4649874
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发表时间：
2008
期刊：
影响因子：
--
通讯作者：
Nishida,Toshikazu
中科院分区：
文献类型：
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作者：
Patrick,Erin;Sankar,Viswanath;Rowe,William;Yen,Sheng-Feng;Sanchez,JustinC;Nishida,Toshikazu
本文描述了完全植入式神经记录系统的基板的工艺流程和测试。钨微丝混合封装在微加工柔性聚合物基板上，形成用于脑机接口的皮质内微电极阵列。微电极阵列在台式上进行表征并在体内进行测试。微电极本底噪声小于 2 μV，急性记录结果显示信噪比为 9.9–17.3 dB。柔性基板上电极的混合制造技术为植入式神经记录系统的开发提供了通用平台
This paper describes the process flow and testing of a substrate for a fully implantable neural recording system. Tungsten microwires are hybrid-packaged on a micromachined flexible polymer substrate forming an intracortical microelectrode array for brain machine interfaces. The microelectrode array is characterized on the bench top and tested in vivo. The microelectrode noise floor is less than 2 μV and acute recording results show a signal to noise ratio of 9.9–17.3 dB. The technique of hybrid fabrication of the electrodes on a flexible substrate provides a general platform for the development of an implantable neural recording system