Review on Trace of Plane Lapping/polishing
Review on Trace of Plane Lapping/polishing
复制标题
DOI：
--
复制
发表时间：
2009
期刊：
影响因子：
--
通讯作者：
Wang Zhi-wei;M. Key
中科院分区：
文献类型：
--
作者：
Wang Zhi-wei;M. Key
回顾了平面研磨/抛光的轨迹，包括单面研磨/抛光和双面研磨/抛光两种方式。前者包括几种类型的双轴（一定和不确定偏心），线性，振荡，计算机控制的小工具，后者是行星研磨/抛光模式。阐述了平面研磨/抛光轨迹均匀性的研究方法，讨论了上述研磨/抛光模式的数学函数和轨迹均匀性，分析了当前轨迹研究的不足。
The trace of plane lapping/polishing is reviewed, involving single side and double side lapping/polishing mode. The former includes several types of two-axle (certain and uncertain eccentricity), linear, oscillating, computer-controlled small tool and the latter is planetary lapping/polishing mode. The research method of the trace uniformity of plane lapping/polishing is described, and the mathematical function and the uniformity of trace for lapping/polishing modes mentioned above are discussed, and the deficiency of the current trace study is analyzed.