Characteristics of Al2O3/diamond/c-BN/SiC grain steel brazing joints using Cu–Sn–Ti active filler powder alloys

Characteristics of Al2O3/diamond/c-BN/SiC grain steel brazing joints using Cu–Sn–Ti active filler powder alloys
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DOI:
10.1016/j.surfcoat.2015.12.055
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发表时间:
2016-01
影响因子:
5.4
通讯作者:
Sixing Liu;X. Bing;Xiao Haozhong;Long Meng;Ziyu Zhang;Wu Hengheng
Sixing Liu;X. Bing;Xiao Haozhong;Long Meng;Ziyu Zhang;Wu Hengheng
中科院分区:
材料科学1区
文献类型:
--
作者:
Sixing Liu;X. Bing;Xiao Haozhong;Long Meng;Ziyu Zhang;Wu Hengheng

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采用铜锡钛活性粉末填充合金在0.45%C钢基上真空钎焊了金刚石、c-BN、Al_2O_3和碳化硅磨料晶体,研制了一种新型超硬砂轮。钎焊工艺在真空中进行,温度分别为890℃、925℃和960℃,保温时间为10-30分钟。采用光学显微镜、扫描电子显微镜(SEM)、能谱仪(EDS)和X射线衍射仪(X射线衍射仪)研究了磨粒与钎料之间的界面特征。显微分析结果表明,活性粉末填充材料中的钛元素优先扩散到颗粒表面,形成了富钛反应层。通过X射线衍射仪分析,确定了TiC、TiN、TiB、TiB2、TiO2和TiSi2在颗粒/活性填料界面和活性填料/钢界面的显微组织相。晶粒与0.45%C钢的连接是通过界面上的钛基反应产物实现的。对连接界面进行了粘接强度实验,结果表明颗粒没有从粘接界面上剥离。
Diamond, c-BN, Al2O3and SiC abrasive crystals were brazed onto 0.45%C steel matrix using Cu–Sn–Ti active powder filler alloys in vacuum to develop a new superhard abrasive wheel. The brazing process was carried out in vacuum at the temperatures of 890 °C, 925 °C, and 960 °C for dwell durations from 10 to 30 min, respectively. The interface characteristics of the brazed joints between the abrasive grains and the filler alloys were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results by microanalyses show that the element of Ti from the active powder filler was diffused preferentially to the surface of the grains, resulting in a Ti-rich reaction layer in the brazed joints. The microstructure phases of TiC, TiN, TiB, TiB2, TiO and TiSi2in the grains/active filler interface and Cu–Ti in the active filler/steel interface were confirmed by XRD analysis. The joining of the grains to the 0.45%C steel was realized by the reaction products of Ti-based on the interface. The adhesive strength experiment of the joint interfaces was performed; the results suggest that the grains were not dislodged from the bond interface.