Ostwald ripening of end-of-range defects in silicon
Ostwald ripening of end-of-range defects in silicon
复制标题
硅中范围末端缺陷的奥斯特瓦尔德成熟
DOI:
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发表时间:
1998
期刊:
影响因子:
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通讯作者:
A. Claverie
中科院分区:
文献类型:
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作者:
C. Bonafos;D. Mathiot;A. Claverie
End-of-range (EOR) defects are interstitial type dislocation loops which nucleate just beneath the crystalline/amorphous (c/a) interface formed by ion implantation in Si, after the preamorphization of the substrate, and during the ramping-up of the anneal. They originate from the presence of a high supersaturation of “excess” Si self-interstitial atoms located just beneath the c/a interface. Upon annealing, the mean radius of the defects increases while their density decreases through the exchange of Si self-interstitial atoms between the loops. The number of interstitials stored in the loops stays constant. For sufficiently high thermal budgets, when the nucleation is finished, and when the local equilibrium between extended and point defects is established, the coarsening of the EOR defects can be modeled through the Ostwald ripening theory applied to the dislocation loops geometry. Indeed, and as expected from the theory, the square of the mean radius of the loop population increases with time while th...