Crack propagation speed in ceramic during quenching
Crack propagation speed in ceramic during quenching
复制标题
陶瓷淬火时裂纹扩展速度
DOI：
10.1016/j.jeurceramsoc.2018.02.028
复制
发表时间：
2018
影响因子：
5.7
通讯作者：
Song Fan
中科院分区：
文献类型：
--
作者：
Shao Yingfeng;Liu Boyang;Wang Xiaohuan;Li Long;Wei Jiachen;Song Fan
通过对半透明陶瓷进行水淬和高速成像，实时研究了水淬温度和试样尺寸对热冲击裂纹扩展速度的影响。结果表明：裂纹扩展速率随淬火温差和试样尺寸的增大而增大；在100 ms内，20 mm宽的陶瓷在400 °C温差下的平均裂纹速度为20.3 mm/s； 5 mm宽的陶瓷在220 °C温差下的平均裂纹速度为11.9 mm/s。与试样尺寸相比，淬火温差对裂纹扩展速度的影响更大。基于细观损伤力学的计算结果与实验结果相似。本文实时定量研究了陶瓷热冲击裂纹扩展过程，拓展了对陶瓷热冲击裂纹现象的科学认识。
The effects of water quenching temperature and specimen size on the propagation speed of thermal shock crack are investigated in real time by water quenching of translucent ceramic and high-speed imaging. The results show that the crack growth rate increases with the increase of quenching temperature difference or specimen size. Within 100 ms, average crack speed is 20.3 mm/s at a temperature difference of 400 °C in 20 mm wide ceramic and is 11.9 mm/s at a temperature difference of 220 °C in 5 mm wide ceramic, respectively. Compare with specimen size, the influence of quenching temperature difference on the crack propagation speed is larger. The calculations based on meso-damage mechanics have similar results to those of experiments. This paper quantitatively studies the thermal-shock crack growth of ceramic in real time and expands the scientific understanding of thermal shock cracking phenomenon of ceramic.