Packaging materials for 2.5/3D technology
Packaging materials for 2.5/3D technology
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适用于2.5/3D技术的封装材料
DOI：
10.1109/isapm.2013.6510392
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
B. Schmaltz
中科院分区：
文献类型：
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作者：
B. Schmaltz
先进的移动设备时代即将到来，我们准备好了吗？更低的功耗、更快的处理速度、高可靠性、高产量、低成本，这些都是工程师们非常熟悉的词汇。采用插入器技术的2.5/3D、直通硅通孔(Tsv)、小于50μm的芯片厚度是工程师用来解决这些问题的几种最新技术。随着技术进步到更小的工艺世代，新的包装应用被要求。铜柱凸点、热压焊(TCB)和晶片级/预涂覆材料的进步推动了标准焊料回流焊工艺的发展。本次演讲将集中讨论用于先进封装技术的NAMICS材料的最新进展：毛细管底填充(CUF)、预涂覆材料、非导电浆料(NCP)、非导电薄膜(NCF)。
The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level/pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).