CLOSURE AND REPROPAGATION OF HEALED CRACKS IN SILICATE GLASS
CLOSURE AND REPROPAGATION OF HEALED CRACKS IN SILICATE GLASS
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DOI：
10.1111/j.1151-2916.1985.tb16160.x
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发表时间：
1985-01-01
影响因子：
3.9
通讯作者：
FULLER, ER
中科院分区：
文献类型：
--
作者：
MICHALSKE, TA;FULLER, ER
在湿度为0.01%至100%的情况下，钠钙硅和玻璃质二氧化硅玻璃中的裂纹在有限载荷下会闭合。与裂纹闭合相关的力（0.15 J/m2）可以通过涉及表面吸附水分子的氢键键的模型进行预测。重新打开玻璃质二氧化硅中的愈合裂纹的断裂能也在氢键相互作用的范围内。在使用的最干燥环境中，钠钙硅玻璃中愈合的裂缝需要1.7 ± 0.2 J/m2才能重新打开。这种结合能可以归因于断裂表面之间阳离子桥或硅氧烷键的形成。由于观察到裂纹愈合是独立的循环次数，阳离子桥接模型是有利于解释在室温下的愈合效果。
Cracks in soda‐lime‐silica and vitreous silica glass close against a finite load at humidities between 0.01 % and 100%. The force associated with crack closure (0.15 J/m2) can be predicted by a model which involves hydrogen‐bonded linkages of surface‐adsorbed water molecules. The fracture energy to reopen healed cracks in vitreous silica is also in the range of hydrogen‐bonding interactions. In the driest environments used, healed cracks in soda‐lime‐silica glass required 1.7 ± 0.2 J/m2to reopen. This bonding energy can be attributed to the formation of either cationic bridges or siloxane bonds between fracture surfaces. Since crack healing was observed to be independent of the number of cycles, a cationic bridging model is favored to explain healing effects at room temperature.