Molecular dynamics simulation and in situ TEM study of crack healing
Molecular dynamics simulation and in situ TEM study of crack healing
复制标题
裂纹愈合的分子动力学模拟和原位TEM研究
DOI：
10.1179/026708302225006133
复制
发表时间：
2002-10-01
影响因子：
1.8
通讯作者：
Chu, WY
中科院分区：
文献类型：
--
作者：
Gao, KW;Li, S;Chu, WY
In situ TEM observation of crack healing during heating was carried out in an alpha-Fe crystal, and the results indicated that a crack in alpha-Fe could completely heal when the temperature increased to a critical value. The molecular dynamics method was used to simulate crack healing during heating and/or under compressive stress in a Cu crystal. The simulation results showed that a centre crack in a Cu crystal would close under a compressive stress or by heating. The roles of compressive stress and heating in crack healing were additive. During crack healing, dislocations generation and motion occurred. If there were pre-existing dislocations around the crack, the critical temperature or compressive stress necessary for crack healing would decrease, and the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for a crack to heal depended upon the orientation of the crack plane.
