Work of indentation methods for determining copper film hardness
Work of indentation methods for determining copper film hardness
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DOI：
10.1016/j.surfcoat.2004.02.003
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发表时间：
2005-03-01
影响因子：
5.4
通讯作者：
Laugier, MT
中科院分区：
文献类型：
--
作者：
Beegan, D;Chowdhury, S;Laugier, MT
研究了在氧化硅衬底上溅射沉积铜膜的压痕硬度。结果初步分析的奥利弗和法尔的方法。AFM成像的压头显示堆积材料在边缘的压痕，这需要考虑到在硬度计算。因此，通过AFM分析测量实际面积和体积以及通过压痕法的工作来重新计算硬度。并对这些方法的结果进行了比较。(C)2004年爱思唯尔B.V.保留所有紧身衣。
We have investigated the indentation hardness of sputter deposited copper films on oxidised silicon substrates. The results were initially analysed by the Oliver and Pharr method. AFM imaging of the indenter revealed pile-up material at the edges of the indents, which needs to be accounted for in the hardness calculation. Thus, the hardness is recalculated by measurement of the actual areas and volume by AFM analysis and also by work of indentation methods. A comparison between the results obtained by these methods is made. (C) 2004 Elsevier B.V. All tights reserved.