Design Benefits of Hybrid Bonding for 3D Integration
Design Benefits of Hybrid Bonding for 3D Integration
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3D 集成混合键合的设计优势
DOI：
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发表时间：
2021
期刊：
影响因子：
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通讯作者：
P. Franzon
中科院分区：
文献类型：
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作者：
T. Nigussie;Tse;S. Lipa;W. S. Pitts;Javier A. DeLaCruz;P. Franzon
我们目前的电气和热分析的3D数字设计使用混合键合，特别是使用设计规则，和其他属性，为XPERI DBI®技术在$mathrm{1.6} μ mathrm{m}$焊盘间距。我们还讨论了混合键合相对于热压键合（TCB）和2D设计的优势。当我们做这项工作时，商业3D物理设计工具还不成熟，所以我们提出了一种基于2D工具的方法。我们的设计流程包括最佳的键合位置分配脚本，网表和延迟约束的分区，以及涉及延迟约束迭代的优化技术。分析了各种分区方案，包括针对长网，管理层之间的触发器分布，以及使用开源工具的最小切割分区。由于分析结果可能会有所不同，从设计到设计，我们提出了潜在的指标，可用于识别设计，可能受益于3DIC技术。分析结果表明，我们能够减少布线长度高达57%。逻辑功耗和总功耗分别下降了34%和22%。硅面积也提高了11%。11这项工作得到了Xcad的部分支持。分配报表A.已批准公开发行：发行不限。
We present electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $mathrm{1.6} mu mathrm{m}$ pad pitch. We also go over the advantages of hybrid bonding over thermo-compression bonding (TCB) and 2D designs. Commercial 3D physical design tools were not mature when we did this work, so we came up with a methodology that builds on 2D tools. Our design flow includes scripts for optimal assignment of bonding locations, partitioning of netlist and delay constraints, and optimization techniques that involve iterating on delay constraints. Various partitioning schemes that include targeting long nets, managing flip-flop distribution between tiers, and minimum cut partitioning using an open source tool were analyzed. Because analysis results could vary from design to design, we propose potential metrics that can be used to identify designs that may benefit from 3DIC technology. Analysis results showed that we were able to reduce routed wire length by up to 57%. Logic power and total power decreased by up to 34% and 22% respectively. Silicon area also improved by 11%.11This work was supported, in part, by Xperi. DISTRIBUTION STATE-MENT A. Approved for public release: distribution unlimited.