Damage detection and analysis of machined KDP crystal subsurface
Damage detection and analysis of machined KDP crystal subsurface
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发表时间：
2007
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通讯作者：
Kang Renke
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作者：
Kang Renke
采用切片实验和分步刻蚀实验对磷酸二氢钾（KDP）晶体从线切割加工到磨抛过程中的亚表面损伤进行检测。采用OLYMPUS MX40光学显微镜观察表面刻蚀现象和亚表面微裂纹构型，并测量微裂纹深度。结果表明，线切割引起的亚表面微裂纹构型以“偏置图形”为主，最大微裂纹深度为85.59μm，而#600砂轮最大深度降至8.55μm。(001)晶体表面有高密度的方位错蚀坑，三重表面有梯形的低密度蚀坑。本研究为KDP晶体加工的亚表面损伤提供了一种良好的检测和分析方法。
The subsurface damage of Potassium Dihydrogen Phosphate(KDP) crystal machined from line-incision to grinding and polishing was detected using section experiment and step etching experiment.The OLYMPUS MX40 optic microscope was used to observe the surface etching phenomena and the sub-surface micro-crack configurations,and to measure the micro-crack depth.The results show that the subsurface micro-crack configurations induced by line-incision is mainly of "bias-figure",and the max micro-crack depth is 85.59 μm.While by the #600 grinding wheel the max depth reduces to 8.55 μm.The square dislocations etching pits with high density are on(001) crystal surface and the low density etching pits with the figure resembled trapezium are on the tripler surface.This study affords a excellent detection and analysis method for the subsurface damage of KDP crystal machining.