Scanning Kelvin Probe Blister test measurements of adhesive delamination – Bridging the gap between experiment and theory

Scanning Kelvin Probe Blister test measurements of adhesive delamination – Bridging the gap between experiment and theory
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DOI:
10.1016/j.ijadhadh.2016.11.006
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发表时间:
2017-03
影响因子:
3.4
通讯作者:
R. Grothe;Chen-Ni Liu;M. Baumert;O. Hesebeck;G. Grundmeier
R. Grothe;Chen-Ni Liu;M. Baumert;O. Hesebeck;G. Grundmeier
中科院分区:
材料科学2区
文献类型:
--
作者:
R. Grothe;Chen-Ni Liu;M. Baumert;O. Hesebeck;G. Grundmeier

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