Development of microforming process combined with thin film transfer printing
Development of microforming process combined with thin film transfer printing
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DOI：
10.1051/mfreview/2015009
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
Kazushi Koshimizu;Q. Zheng;Tetsuhide Shimizu;M. Yang
中科院分区：
文献类型：
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作者：
Kazushi Koshimizu;Q. Zheng;Tetsuhide Shimizu;M. Yang
近年来，由于微零件在电子和医疗领域的使用不断增加，微成型受到广泛关注。为了进一步实现这些微型器件的功能化，生物和医学领域的器件（例如生物传感器）强烈需要具有贵金属的高功能表面。为了在一次成形过程中实现金属箔的亚毫米结构和微米到纳米结构，本研究提出了一种金属箔微成形和金（Au）薄膜转印的组合工艺。为了阐明所提出的组合工艺的可用性，研究了金薄膜在微凸形变形下的可转移性。 0.1毫米厚的纯钛（Ti）箔和100纳米厚的金膜分别用作空白材料和功能材料。对所提出的工艺进行了成型测试。随着钛箔应变的增加，Au TP 面积增加。通过该实验，证实氧化层的氢还原和Ti箔的应变是Ti箔上Au TP的重要因素。
Microforming receives a lot of attentions in the recent years due to the increased use of microparts in electronics and medical sectors. For the further functionalization of these micro devices, high functional surface with noble metals are strongly required for the devices in bio- and medical fields, such as bio-sensors. To realize the submillimeter structure of metal foils and micro to nanometer structures in one forming process, the present study proposes a combined process of microforming for metal foils and transfer printing of gold (Au) thin films. To clarify the availability of the proposed combined process, transferability of Au thin films under micro bulging deformation are investigated. 0.1 mm-thick pure titanium (Ti) foils and 100 nm-thick Au films were used as blank and functional materials, respectively. The forming tests of the proposed process were conducted. With increasing strain of Ti foils, Au TP areas increase. By this experiment, it’s confirmed that the hydrogen reduction of oxidation layers and the strain of Ti foil are significant factor for Au TP on Ti foils.