Room-temperature bonding for plastic high-pressure microfluidic chips
Room-temperature bonding for plastic high-pressure microfluidic chips
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DOI：
10.1021/ac070220w
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发表时间：
2007-07-01
影响因子：
7.4
通讯作者：
Frechet, Jean M. J.
中科院分区：
文献类型：
--
作者：
Mair, Dieudonne A.;Rolandi, Marco;Frechet, Jean M. J.
已经开发并优化了一种用于快速、可重复且坚固地粘合塑料制成的微流体芯片的通用方法。在使配合部件接触并施加载荷之前，将其中一个结合表面暴露于溶剂蒸气。原子力显微镜进行的纳米压痕测量表明，一个可逆的材料软化发生后，暴露于溶剂蒸气。随后将粘合的芯片暴露于紫外光下，然后加强了配合部件之间的粘合，并通过尺寸排阻色谱-多角度光散射（SEC-MALS）测量，由于部分交联和断链反应，使爆破压力增加了50%。在室温下执行该过程的所有步骤消除了在热结合期间观察到的通道变形，并提供具有高度均匀的横截面尺寸的通道。我们的技术使芯片能够承受高达34.6 MPa的压力。
A generic method for the rapid, reproducible, and robust bonding of microfluidic chips fabricated from plastics has been developed and optimized. One of the bonding surfaces is exposed to solvent vapor prior to bringing the mating parts into contact and applying a load. Nanoindentation measurements performed by atomic force microscopy show that a reversible material softening occurs upon exposure to solvent vapor. Subsequent exposure of the bonded chip to UV light then strengthens the bond between mating parts and increases the burst pressure by 50% due to partial cross-linking and chain scission reactions as measured by size exclusion chromatography-multiangle light scattering (SEC-MALS). Performing all steps of this procedure at room temperature eliminates channel distortion observed during thermal bonding and affords channels with highly uniform cross-sectional dimensions. Our technique enables chips resistant to pressures as high as 34.6 MPa.