Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
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DOI：
10.1109/tcapt.2005.853593
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发表时间：
2005-08
影响因子：
--
通讯作者：
Luhua Xu;J. Pang;K. Prakash;T. H. Low
中科院分区：
文献类型：
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作者：
Luhua Xu;J. Pang;K. Prakash;T. H. Low
无铅焊料和具有不同表面光洁度（Cu和Ni/Au）金属化的Pb基焊料之间的界面金属间化合物（IMC）的生长是电子组件中长期焊点可靠性性能的主要关注点。IMC层的生长速率会影响焊点的可靠性。分析了无铅钎料和铅基钎料在等温时效和热循环时效条件下钎料-基体界面IMC生长的固相扩散机制。通过等温时效和热循环时效研究了Sn3.8Ag0.7Cu和Ni/Au表面处理层间IMC层的生长行为。建立了一个完整的模型来描述Ni-Cu-Sn合金在TC时效过程中的IMC生长行为。模拟结果与试验结果的对比表明，TC时效加速了IMC层的生长。值得注意的是，来自各种参考文献的IMC层生长研究显示了对于液态和固态反应的不同实验数据和生长动力学参数。
The growth of interfacial intermetallic compounds (IMC) between Pb-free and Pb-based solders with different surface finish (Cu and Ni/Au) metallization is a major concern for long-term solder joint reliability performance in electronic assemblies. The growth rate of the IMC layer can affect the solder joint reliability. Analysis of solid-state diffusion mechanism for the growth of IMC between solder-to-substrate interface for Pb-free and Pb-based solders subject to isothermal and thermal cycling aging were conducted. Experimental study of IMC layer growth between Sn3.8Ag0.7Cu and Ni/Au surface finish by isothermal aging versus thermal cycling (TC) aging was investigated to develop a framework for correlating IMC layer growth behavior. An integrated model for IMC growth was derived to describe the Ni-Cu-Sn IMC growth behavior subject to TC aging. Comparison of modeling and test results showed that IMC layer growth rate under TC aging was accelerated. It is noted that IMC layer growth study from various references showed different experimental data and growth kinetic parameters for both liquid-state and solid-state reactions.