Introduction of amino functionalities on ethylene-co-tetrafluoroethylene film surfaces by NH3 plasmas
Introduction of amino functionalities on ethylene-co-tetrafluoroethylene film surfaces by NH3 plasmas
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DOI：
10.1163/156856105774429064
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发表时间：
2005-01
影响因子：
2.3
通讯作者：
N. Inagaki;K. Narushima;K. Kuwabara;K. Tamura
中科院分区：
文献类型：
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作者：
N. Inagaki;K. Narushima;K. Kuwabara;K. Tamura
为了形成接枝氨基的活性位点，使用等离子体辐照技术从含氟聚合物如聚（四氟乙烯）、乙烯-共聚-四氟乙烯共聚物（ETFE）和聚（偏二氟乙烯）中进行了氟原子的主要消除，并且研究了在含氟聚合物表面上可以形成氨基官能团的可能性。NH3等离子体照射导致从含氟聚合物中大量消除氟原子，以及接枝氮官能团。含氮基团的形成受到W/FM参数的大小的强烈影响，并且发现在79 MJ/kg的低W/FM参数下操作的NH3等离子体对于表面改性过程是优选的。NH3等离子体改性表面的XPS光谱表明，NH3等离子体主要攻击ETFE聚合物中的CF2-CF2序列，而不是CH 2-CH 2序列。通过荧光测量确定在ETFE膜表面上形成的伯氨基。表面上形成的氨基的浓度不是恒定的，而是根据W/FM参数而变化。发现在79 MJ/kg的低W/FM参数下操作的NH3等离子体在ETFE膜表面上接枝氨基中是优选的。
In order to form active sites for grafting amino groups, a predominant elimination of fluorine atoms from fluoropolymers such as poly(tetrafluoroethylene), ethylene-co-tetrafluoroethylene co-polymer (ETFE) and poly(vinylidene fluoride) was carried out using the plasma irradiation technique, and the possibility that amino functional groups could be formed on the fluoropolymer surfaces was investigated. The NH3 plasma irradiation led to considerable elimination of fluorine atoms from the fluoropolymers, as well as grafting of nitrogen functionalities. The formation of nitrogen-containing groups was strongly influenced by the magnitude of the W/FM parameter, and the NH3 plasma operated at a low W/FM parameter of 79 MJ/kg was found to be preferable for the surface modification process. XPS spectra for the NH3 plasma-modified surfaces showed that the NH3 plasma attacked predominantly CF2—CF2 sequences rather than CH2—CH2 sequences in the ETFE polymer. The primary amino groups formed on the ETFE film surfaces were determined by fluorescence measurements. The concentration of the amino groups formed on the surfaces was not constant but varied according to the W/FM parameter. NH3 plasma operated at a low W/FM parameter of 79 MJ/kg was found to be preferable in grafting amino groups on the ETFE film surfaces.