Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition
Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition
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DOI：
10.1109/tpel.2022.3151411
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发表时间：
2022-07
影响因子：
6.7
通讯作者：
Jie Chen;E. Deng;Yiming Zhang;Yongzhang Huang
中科院分区：
文献类型：
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作者：
Jie Chen;E. Deng;Yiming Zhang;Yongzhang Huang
在压装IGBT（PP IGBT）的双面冷却条件下测量结到壳热阻Rthjc是一个很大的挑战，因为通过两个热路径的热流很难被准确地提取。本文提出了一种仅通过温度测量间接确定双面散热比例的方法，用于同时测量双面冷却条件下PP IGBT的两个单面Rthjc，并对4500 V/3000 A PP IGBT进行了测试。测试结果表明，所测得的Rthjc不是一个固定值，而是与测试中所用的负载电流有关，它随着负载电流的增大而增大，这与传统的引线键合IGBT模块不同。建立了热力双向耦合有限元模型，解释了器件变形引起内部热流分布变化的影响机理。此外，提出了一种更简单的双面Rthjc定义方法，即直接取双面壳体温度的平均值作为壳体温度来计算热阻，并在理论分析和实验的基础上讨论了两种方法的等效性。
Junction-to-case thermal resistance Rthjc measurement under a double-side cooling condition of press-pack IGBTs (PP IGBTs) is a great challenge since the heat flow through the two heat paths is hard to be accurately extracted. In this article, an indirect method determining the proportion of heat dissipation on both sides only by temperature measurement is proposed to simultaneously measure two single-sided Rthjc of PP IGBTs under the double-side cooling condition, and it is performed with 4500 V/3000 A PP IGBTs. The test results show that the measured Rthjc is not a fixed value but is related to the load current used in the test, it increases as the load current increases, which is different from the traditional wire-bonded IGBT module. A thermomechanical bidirectional coupling finite element model is built to explain the impact mechanism that the deformation of the device causes the change of internal heat flow distribution since the components will be properly separated. In addition, a simpler double-sided Rthjc definition method that directly takes the average value of the case temperature on both sides as the case temperature to calculate the thermal resistance is developed, and the equivalence of the two methods are discussed based on the theoretical analysis and experiment.