CRACK HEALING AND STRENGTHENING OF THERMALLY SHOCKED ALUMINA
CRACK HEALING AND STRENGTHENING OF THERMALLY SHOCKED ALUMINA
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DOI:
10.1111/j.1151-2916.1976.tb10949.x
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发表时间:
1976-01-01
影响因子:
3.9
通讯作者:
GUPTA, TK
中科院分区:
文献类型:
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作者:
GUPTA, TK
Crack healing and strengthening of thermally shocked alumina are related to pore evolution in the microstructure during annealing. Grain growth is not necessary for either an increase or a decrease in strength following heat treatment.