Improving the accuracy of junction temperature measurement with the square-root-t method

Improving the accuracy of junction temperature measurement with the square-root-t method
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利用平方根t法提高结温测量精度

DOI:
10.1109/therminic.2013.6675204
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发表时间:
2013
期刊:
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
影响因子:
--
通讯作者:
A. Hensler
A. Hensler
中科院分区:
--
文献类型:
--
作者:
C. Herold;M. Beier;J. Lutz;A. Hensler

文献摘要

被引文献

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本文讨论了如何平方根t法提高了功率循环测试装置中的虚结温Tvj的测量。通过应用该方法,测量变得对测量延迟和EMC噪声更宽容,因此它能够锐化寿命估计的基础。然而,虚拟结温仍然是三维温度梯度的一维映射,其与CTE失配结合在互连材料中诱导应力。因此,将Tvj测量数据与IR图像中发现的陈述进行比较。
This paper discusses how the square-root-t method improves the measurement of the virtual junction temperature Tvj in a power cycling test setup. By applying this method, the measurement becomes more tolerant to measurement delays and EMC noise, thus it enables to sharpen the basis of life time estimations. However the virtual junction temperature remains a one dimensional mapping of the three-dimensional temperature gradient which combined with CTE-mismatch induces stress in the interconnection materials. Therefore Tvj-measurement data are compared to statements found in IR-images.