Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints
Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints
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DOI：
10.1016/j.jallcom.2013.07.058
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发表时间：
2013-12
影响因子：
6.2
通讯作者：
Z. W. Yang;Wei Zhou;P. Wu
中科院分区：
文献类型：
--
作者：
Z. W. Yang;Wei Zhou;P. Wu
研究了添加和不添加镀镍多壁碳纳米管的线型Cu/Sn-Ag-Cu/Cu互连线的电迁移行为。钎焊后，在钎料/Cu界面处形成了（Cu，Ni）6Sn 5金属间化合物。电迁移分析表明，碳纳米管的存在可以有效地抑制电迁移引起的原子在焊料中的扩散。有限元模拟结果表明，碳纳米管网络能够降低钎料基体中的电流密度，从而提高复合钎料的抗电迁移性能。
The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni)6Sn5intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.