Two rapid and simple methods used for the removal of resins from 1.0 μm thick epoxy sections
Two rapid and simple methods used for the removal of resins from 1.0 μm thick epoxy sections
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用于从 1.0 μm 厚的环氧树脂切片上去除树脂的两种快速且简单的方法
作者：
M. Maxwell
超薄环氧切片常用于电子显微镜。在光学显微镜下检查较厚（0.5-3.0 μm）的树脂切片通常可以获得更多有用的信息。然而，有一些组织学染色剂不能渗透这些树脂。
Ultrathin epoxy sections are commonly used in electron microscopy. More useful information can often be obtained by examining thicker (0.5–3.0 μm) resin sections under the light microscope. However, there are some histological stains that are unable to penetrate these resins.