Measurement of coefficient of thermal expansion of films using digital image correlation method
Measurement of coefficient of thermal expansion of films using digital image correlation method
复制标题
数字图像相关法测量薄膜热膨胀系数
DOI：
10.1016/j.polymertesting.2008.11.004
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发表时间：
2009-02-01
期刊：
影响因子：
5.1
通讯作者：
Asundi, Anand
中科院分区：
文献类型：
--
作者：
Pan, Bing;Xie, Hui-min;Asundi, Anand
研究了数字图像相关法（DIC）在薄膜热膨胀系数（CFE）测量中的应用。设计了一个用于施加热载荷的加热室，DIC提供了由于温度变化引起的测试薄膜样品的全场热变形场。然后提取感兴趣区域在x和y方向上的平均法向应变，用于确定CTE。讨论了不可避免的小刚体旋转的影响，并提出了消除小刚体旋转的方法，以显示测试膜的纯热膨胀。为了验证，纯铜样品的热膨胀系数的测定和比较与教科书的值，确认所提出的技术的有效性和准确性。最后，测量了聚酰亚胺（PI）复合膜在20-140 ° C温度范围内的CTE。结果表明，动态图像干涉技术是薄膜全场热变形和热膨胀系数测量的实用有效工具。(C)2008爱思唯尔有限公司保留所有权利。
Applications of the digital image correlation method (DIC) for the determination the coefficient of thermal expansion (CFE) of films is investigated in this paper. A heating chamber was designed for applying thermal load and DIC provides the full-field thermal deformation fields of the test film sample due to temperature changes. The average normal strains in the x and y direction from the region of interest are then extracted for the determination of CTE. The influence of unavoidable small rigid body rotation is discussed and a method to eliminate it to show the pure thermal expansion of the test film is demonstrated. For validation, the CTE of a pure copper sample is determined and compared with the textbook value, confirming the effectiveness and accuracy of the proposed technique. Finally, the CTE of Polyimide (PI) composite film in the temperature range of 20-140 degrees C is measured. The results reveal that the DIC is it practical and effective tool for full-field thermal deformation and CTE measurement of films. (C) 2008 Elsevier Ltd. All rights reserved.