Probability prediction model for bridging defects induced by combined influences from lithography and etch variations

Probability prediction model for bridging defects induced by combined influences from lithography and etch variations
复制标题

光刻和蚀刻变化综合影响引起的桥接缺陷的概率预测模型

DOI:
10.1117/1.jmm.18.2.023503
复制
发表时间:
2019
期刊:
Journal of Micro/Nanolithography, MEMS, and MOEMS
影响因子:
--
通讯作者:
Tianchun Ye
Tianchun Ye
中科院分区:
其他
文献类型:
--
作者:
Xiaojing Su;Dong Shen;Yayi Wei;Taian Fan;Lisong Dong;Libin Zhang;Yajuan Su;Rui Chen;Tianchun Ye

文献摘要

相似文献