Versatile direct laser writing of non-photosensitive materials using multi-photon reduction-based assembly of nanoparticles
Versatile direct laser writing of non-photosensitive materials using multi-photon reduction-based assembly of nanoparticles
复制标题
DOI：
10.1038/s41598-019-50630-1
复制
发表时间：
2019-10-04
影响因子：
4.6
通讯作者：
Kimura, Kaito
中科院分区：
文献类型：
--
作者：
Nishiyama, Hiroaki;Umetsu, Kan;Kimura, Kaito
多功能直接激光写入（DLW），不受材料光敏性的限制，为集成光子学，电子学和材料科学中的微/纳米纤维提供了基础和技术创新的机会。虽然DLW在微/纳米器件制造中具有很高的潜力，但材料选择受到固有的限制：DLW不能应用于非光敏材料。描述了一种新发现的基于飞秒激光多光子还原的溶液中微粒快速组装现象。这种现象允许写入具有填充有纳米颗粒的厚包覆层的微图案。即使在SiO2等非光敏材料的情况下，我们也通过移动激光焦点来写入连续图案。通过超越严格的材料限制，这种新颖的激光写入过程有望成为各种科学领域的强大工具。
Versatile direct laser writing (DLW), not limited by material photosensitivity, offers opportunities for fundamental and technological innovation for micro-/nanofabrication in integrated photonics, electronics and material science. Although DLW has high potential in micro-/nanodevice fabrication, material choice suffers an intrinsic limitation: DLW cannot be applied to non-photosensitive materials. We describe a newly discovered rapid-assembly phenomenon of fine particles based on femtosecond laser multi-photon-reduction in solution. This phenomenon allowed the writing of micropatterns with thick clad layers filled with nanoparticles. We wrote continuous patterns by moving the laser focus even in the case of non-photosensitive material such as SiO2. By transcending the strict material limitation, this novel laser writing process promises to be a powerful tool in a variety of scientific fields.