Relief of the residual stresses in Si3N4/Invar joints by multi-layered braze structure - Experiments and simulation
Relief of the residual stresses in Si3N4/Invar joints by multi-layered braze structure - Experiments and simulation
复制标题
通过多层钎焊结构消除 Si3N4/Invar 接头中的残余应力 - 实验和模拟
DOI：
10.1016/j.ceramint.2016.01.096
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发表时间：
2016-05-01
影响因子：
5.2
通讯作者：
Zhang, Jie
中科院分区：
文献类型：
--
作者：
Wang, Tianpeng;Ivas, Toni;Zhang, Jie
设计了一种Ag-Cu-Ti+TiNp/Cu/Ag-Cu三层钎料，用于Si 3 N4陶瓷与因瓦合金的钎焊。研究了铜箔厚度对钎焊接头组织和力学性能的影响。与单层Ag-Cu-Ti+TiNp填料相比，多层填料能有效抑制Fe 2 Ti和Ni 3 Ti化合物的生成。当使用200 μ m厚的Cu中间层时，钎焊接头的剪切强度比单一Ag-Cu-Ti+TiNp钎料钎焊接头的剪切强度提高47.9%。设计了一个简化的单胞模型，以获得的TiNp增强填料的物理性能。该模型提供了满足Hashin-Shtrikman边界和N. Ramalcrishnan方程。在三层钎焊中，有限元（FE）模型表明，系统的残余应力显着降低，通过增加铜箔的厚度在多层系统。(C)2016 Elsevier Ltd和Techna Group S.r.l. All rights reserved.
An Ag-Cu-Ti+TiNp/Cu/Ag-Cu three-layered filler was designed to braze Si3N4 ceramic and Invar alloy. The effect of the Cu-foil thickness on the microstructure and the mechanical properties of the brazed joints was investigated. Compared with single-layer Ag-Cu-Ti+TiNp filler, the formation of Fe2Ti and Ni3Ti compounds is widely inhibited by using multi-layered filler. The shear strength of the brazed joint is 47.9% higher than that of joints brazed with single Ag-Cu-Ti+TiNp filler when a 200 mu m thick Cu interlayer is used. A simplified unit cell model was designed to obtain the physical properties of the TiNp reinforced filler. The model provides the elastic modulus and yield stress that satisfy the Hashin-Shtrikman bounds and N. Ramalcrishnan's equations, respectively. In the three-layered brazing, the finite element (FE) model shows that system residual stresses decrease significantly by increasing the thickness of Cu foil in the multi-layered system. (C) 2016 Elsevier Ltd and Techna Group S.r.l. All rights reserved.