Iodine-Based Sensitization of Copper Alloys to Enable Self-Terminating Etching for Support Removal and Surface Improvements of Additively Manufactured Components
Iodine-Based Sensitization of Copper Alloys to Enable Self-Terminating Etching for Support Removal and Surface Improvements of Additively Manufactured Components
复制标题
铜合金的碘基敏化可实现自终止蚀刻，以去除支撑物并改善增材制造组件的表面
DOI：
10.1089/3dp.2021.0242
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发表时间：
2022
影响因子：
3.1
通讯作者：
Hildreth, Owen J.
中科院分区：
文献类型：
--
作者：
Yazdanparast, Sanaz;Raikar, Subbarao;Heilig, Meredith;Hildreth, Owen J.
在过去的二十年中，金属的选择性激光熔化（SLM）的进步使金属增材制造更容易被工业采用。尽管印刷工艺有所改进，但SLM组件的后处理并未得到很大改善，导致相当大的成本、延迟和设计限制。在基于敏化的自终止蚀刻工艺的最新进展的基础上，这项工作详细介绍了一套新的基于碘的敏化和蚀刻化学，简化了使用SLM制造的铜（Cu）合金部件的后处理。这项工作表明，碘可用于“敏化”铜合金组件的表面，以形成可溶性碘化铜盐，然后可将其溶解在常见溶剂中，如乙腈。该过程以自终止方式从所有内表面和外表面去除预定量的材料，从而能够容易地去除内部和外部支撑件，去除任何捕获的粉末，以及平滑内表面和外表面。我们证明了这一过程GRCop（铜铬铌）合金，由于其广泛使用的火箭推进工业沿着与示范铜（110）的应用在热交换器和电磁发射器/接收器。我们的研究结果提供了第一个系统的研究碘化温度和持续时间的影响，在GRCop-84组件的碘化物区域的厚度。此外，还对GRCop-84在每次碘化溶解之前和之后的表面粗糙度进行了量化，并且显示出在四次碘化溶解循环之后粗糙度从印刷的10 μm的高值降低到3 μm的低值70%。
Advances in selective laser melting (SLM) of metals in the past two decades have made metals additive manufacturing more accessible for industrial adoption. Despite printing process improvements, post-processing of SLM components has not improved much, resulting in considerable costs, delay, and design limitations. Building upon recent advances in sensitization-based self-terminating etching processes, this work details a new set iodine-based sensitization and etching chemistries that simplify the post-processing of copper (Cu) alloy components fabricated using SLM. This work demonstrates that iodine can be used to “sensitize” the surface of copper alloy components to form soluble copper iodide salt that can be then dissolved in common solvents, such as acetonitrile. This process removes a predefined amount of material from all interior and exterior surfaces in a self-terminating manner, enabling facile removal of internal and external supports, removal of any trapped powder, and the smoothing of interior and exterior surfaces. We demonstrate this process on GRCop (Cu-chromium-niobium) alloys due to their widespread use by the rocket propulsion industry along with a demonstration in copper (110) for applications in heat exchangers and electromagnetic transmitters/receivers. Our results provide the first systematic study on the effect of iodization temperature and duration on the thickness of the iodide region in GRCop-84 components. Additionally, the surface roughness before and after each iodization–dissolution was also quantified for GRCop-84 and showed 70% reduction in Raroughness from a high of 10 μm as-printed to a low of 3 μm after four iodization–dissolution cycles.