On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
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DOI：
10.1016/j.scriptamat.2012.01.009
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发表时间：
2012-04
影响因子：
6
通讯作者：
K. Yazzie;H. Xie;Jason J. Williams;N. Chawla
中科院分区：
文献类型：
--
作者：
K. Yazzie;H. Xie;Jason J. Williams;N. Chawla
富锡焊料与应变率相关的机械行为至关重要。假设动态焊点强度由两个因素控制。在低应变速率下，它被认为是由块状焊料控制的，而在高应变速率下是由脆性金属间化合物层控制的。本文对 Sn-3.9Ag-0.7Cu 焊点的动态焊点强度进行了实验量化，以验证焊料和金属间化合物控制行为假设。
The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn–3.9Ag–0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.