Preparation of chemical-resistant atomically ordered Sn-Ni alloy films by electroless plating
Preparation of chemical-resistant atomically ordered Sn-Ni alloy films by electroless plating
复制标题
化学镀制备耐化学腐蚀原子有序Sn-Ni合金薄膜
DOI：
10.1016/j.jallcom.2021.160100
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发表时间：
2021
影响因子：
6.2
通讯作者：
Matsumoto Futoshi
中科院分区：
文献类型：
--
作者：
Gunji Takao;Umehashi Yumi;Tsunoi Hiroki;Yokoi Kento;Kawai Akimasa;Matsumoto Futoshi
采用化学镀的方法在铁板上成功地沉积了Ni-Sn-B三元合金薄膜。镀液中Sn2+离子的浓度对镀锡量和镀膜厚度有很大的影响。用X射线衍射仪、X射线荧光分析和X射线光电子能谱对所制备的Ni-Sn-B合金薄膜进行了表征。X射线衍射结果证实了Ni-SnB合金的晶体结构。当Sn2+浓度在0.03~0.07mmol.L−1时，形成了原子有序的Ni-Sn-B相。将制备的Ni-SnB合金膜在氢氧化钠或双氧水中浸泡10d，得到的合金膜的耐化学性较好，浸泡后膜厚仅有轻微下降。结果表明，Ni-Sn-B合金的原子有序相对耐化学性有一定的贡献。
A ternary Ni-Sn-B alloy film was successfully deposited on an iron plate through electroless plating. The Sn content and film thickness strongly depended on the concentration of Sn2+ions in the plating bath. The prepared Ni-Sn-B alloy films were characterized by X-ray diffraction (XRD) and X-ray fluorescence analyses and X-ray photoelectron spectroscopy. The XRD results confirmed the crystal structure of the Ni-Sn-B alloy. When the Sn2+concentration was between 0.03 and 0.07 mol L−1, an atomically ordered phase of Ni-Sn-B was formed. To estimate the chemical resistance, the prepared Ni-Sn-B alloy films were immersed in NaOH or H2O2for 10 days, and only a small decrease in film thickness was observed after immersion. The results suggested that the atomically ordered phase of the Ni-Sn-B alloy contributed to chemical resistance.