Influences of Bond Interface on Bending Strength of Al/Ni-Reactively-Soldered Si Mechanical Joints
Influences of Bond Interface on Bending Strength of Al/Ni-Reactively-Soldered Si Mechanical Joints
复制标题
键合界面对Al/Ni反应钎焊硅机械接头弯曲强度的影响
DOI：
10.11395/jjsem.19.38
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发表时间：
2019
期刊：
影响因子：
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通讯作者：
前川夏菜，金築俊介，後藤大輝，生津資大
中科院分区：
文献类型：
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作者：
Taisei Izumi;Shugo Miyake;Shunsuke Kanetsuki;and Takahiro Namazu;後藤大輝，訓谷保広，前川夏菜，山本梨乃，金築俊介，三宅修吾，生津資大;前川夏菜，金築俊介，後藤大輝，生津資大
本文研究了控制反应NiAl和钎料界面对Al/Ni反应钎焊单晶硅试样抗弯强度的影响。利用Al/Ni多层膜中的放热反应熔化SnAg-钎料膜制备Si焊点。在瞬时键合之后，通过机械切割制备具有键合部分的Si棒形试样。然后进行四点弯曲试验，以研究弯曲强度和最薄弱的层或界面中的粘结截面。按Al→ Ni→. → Al→ Ni顺序沉积Al/Ni多层膜的试样在基端钎料-NiAl界面处断裂。通过改变沉积顺序为Ni→ Al→…→ Al→ Ni，试样的抗弯强度提高，断裂来源改变。随着自支撑膜的使用，弯曲强度增加更多。机械可靠性的改善将是由于焊料-NiAl界面处的空洞数量的减少。
In this paper, we describe the effect of controlling reacted NiAl and solder bond interface on bending strength of Al/Ni-reactively-soldered single-crystal Si specimens. The exothermic reaction in Al/Ni multilayer film was used to melt SnAg-solder film for producing Si solder joint. After the instantaneous bonding, Si rod-shaped specimens with the bonded section was prepared by mechanical dicing. Four-point bending test was then conducted to investigate the bending strength and the weakest layer or interface in the bonded section. The specimens with Al/Ni multilayer film deposited in the Al→ Ni→…→ Al→ Ni order fractured at the base-side solder-NiAl interface. By changing the deposition order to Ni→ Al→…→ Al→ Ni, the bending strength of the specimens increased and the fracture origin changed. With the usage of the free-standing film, bending strength increased more. The improvement of mechanical reliability would be caused by a reduction of the number of voids at the solder-NiAl interface.