Boosted gate MOS (BGMOS): device/circuit cooperation scheme to achieve leakage-free giga-scale integration

Boosted gate MOS (BGMOS): device/circuit cooperation scheme to achieve leakage-free giga-scale integration
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升压栅MOS(BGMOS):器件/电路合作方案,实现无漏电千兆级集成

DOI:
10.1109/cicc.2000.852696
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发表时间:
2000
期刊:
Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044)
影响因子:
--
通讯作者:
T. Sakurai
T. Sakurai
中科院分区:
--
文献类型:
--
作者:
T. Inukai;M. Takamiya;Kouichi Nose;H. Kawaguchi;T. Hiramoto;T. Sakurai

文献摘要

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本文提出了一种新的器件和电路方案,在保持电路速度的同时,大大抑制了深亚0.1/SPLµ/m时代的待机漏电流。在具有较高V/subTh/和较厚T/subox/的低泄漏开关上施加升压栅极电压,实现了用于电池型应用的极低备用功率,同时充分抑制了电路性能的劣化和面积开销的增加。文中还讨论了与负栅电压方案的结合以及升压方案在SRAM中的应用。
This paper proposes a new device and circuit scheme that drastically suppresses the stand-by leakage current for the deep sub-0.1 /spl mu/m era while maintaining the circuit speed. Applying boosted gate voltage on the low leakage switches with higher V/sub th/ and thicker T/sub ox/, extremely low stand-by power for battery type application is achieved, while degradation of circuit performance and an increase of area overhead are sufficiently suppressed. The combination with a negative gate voltage scheme and the application of the boosted voltage scheme to SRAMs are also discussed.