Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
复制标题
三维多腔高性能微处理器芯片堆栈中两相蒸发传热的建模
DOI：
10.1115/1.4027436
复制
发表时间：
2014
影响因子：
1.6
通讯作者：
J. Thome
中科院分区：
文献类型：
--
作者：
Yassir Madhour;B. d'Entremont;J. Marcinichen;B. Michel;J. Thome
集成电路（IC）裸片的三维（3D）堆叠通过将两个或两个以上裸片与区域阵列穿硅通孔（TSV）垂直集成而增加系统密度及封装功能性。这减少了全局互连的长度和信号延迟时间，并允许提高能量效率。然而，热通量和热界面电阻的积累是垂直集成封装的主要限制。可扩展的冷却解决方案，如两相夹层冷却，将需要扩展3D堆栈超过最适度的模具数量。本文介绍了一个逼真的三维芯片堆沿着与模拟方法的散热和流动分配的通道蒸发器。该模型包括每个通道的摩擦系数对蒸汽质量的显着敏感性，因此质量流量对热通量，这是平行两相流的特征。模拟案例探讨了堆栈内热点的各种位置和两相层间冷却所特有的效果。结果表明，热斑对单个芯片的影响可以减轻强层间热传导，如果热斑的相对位置是仔细选择，导致热负荷和流动，这是很好的横向平衡。
Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and the signal delay time and allows improvements in energy efficiency. However, the accumulation of heat fluxes and thermal interface resistances is a major limitation of vertically integrated packages. Scalable cooling solutions, such as two-phase interlayer cooling, will be required to extend 3D stacks beyond the most modest numbers of dies. This paper introduces a realistic 3D chip stack along with a simulation method for the heat spreading and flow distribution among the channels of the evaporators. The model includes the significant sensitivity of each channel's friction factor to vapor quality, and hence mass flow to heat flux, which characterizes parallel two-phase flows. Simulation cases explore various placements of hot spots within the stack and effects which are unique to two-phase interlayer cooling. The results show that the effect of hot spots on individual dies can be mitigated by strong interlayer heat conduction if the relative position of the hot spots is selected carefully to result in a heat load and flow which are well balanced laterally.