In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope
In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope
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DOI：
10.1007/s00170-021-07278-x
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发表时间：
2021-05-22
影响因子：
3.4
通讯作者：
Luo, Xichun
中科院分区：
文献类型：
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作者：
Tian, Dongyu;Xu, Zongwei;Luo, Xichun
由于 3C-SiC 的脆性转变特征尺寸超小，因此通过实验揭示 3C-SiC 的纳米变形行为具有挑战性。在目前的工作中，我们通过在扫描电子显微镜（SEM）下进行原位纳米切割实验，以及通过电子背散射衍射（EBSD）和透射电子显微镜（TEM）进行后表征，阐明了3C-SiC的纳米切割机制。特别是提出了一种基于图像处理技术与SEM在线观察相结合的新方法，实现了不确定度小于1 mN的切削力原位测量。此外，通过原子力显微镜（AFM）对切割横截面进行表征，以获得特定的切割能量。结果表明，由于纳米切削中刀具的尺寸效应，比切削能随着切削深度的减小呈非线性增加。在本实验参数下，高压相变（HPPT）可能在 3C-SiC 延性加工中发挥主要作用。
Experimentally revealing the nanometric deformation behavior of 3C-SiC is challenging due to its ultra-small feature size for brittle-to-ductile transition. In the present work, we elucidated the nanometric cutting mechanisms of 3C-SiC by performing in situ nanometric cutting experiments under scanning electron microscope (SEM), as well as post-characterization by electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). In particular, a new method based on the combination of image processing technology and SEM online observation was proposed to achieve in situ measurement of cutting force with an uncertainty less than 1 mN. Furthermore, the cutting cross-section was characterized by atomic force microscope (AFM) to access the specific cutting energy. The results revealed that the specific cutting energy increase non-linearly with the decrease of cutting depth due to the size effect of cutting tool in nanometric cutting. The high-pressure phase transformation (HPPT) may play the major role in 3C-SiC ductile machining under the parameters of this experiment.