Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process
Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process
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DOI：
10.1016/j.jallcom.2011.01.015
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发表时间：
2011-03-03
影响因子：
6.2
通讯作者：
Jung, Seung-Boo
中科院分区：
文献类型：
--
作者：
Yoon, Jeong-Won;Noh, Bo-In;Jung, Seung-Boo
Sn-3.0 wt.%之间的界面反应Ag-0.5重量%研究了Cu焊料和化学镀镍-化学镀钯-浸金（ENEPIG）基板。在初始回流后，在界面处形成不连续的圆形（Cu，Ni）（6）Sn-5金属间化合物（IMC）。在长达60 min的回流过程中，界面IMC按以下顺序依次变化：不连续的（Cu，Ni）（6）Sn-5，（Cu，Ni）（6）Sn-5和（Ni，Cu）（3）Sn-4，以及嵌入（Cu，Ni）（6）Sn-5在（Ni，Cu）（3）Sn-4中。界面产物的变化是由于焊料中Cu原子的优先消耗和Ni（P）层中Ni的连续扩散造成的。(C)2011 Elsevier B. V.保留所有权利。
The interfacial reactions between Sn-3.0 wt.% Ag-0.5 wt.% Cu solder and an electroless nickel-electroless palladium-immersion gold (ENEPIG) substrate were investigated. After initial reflowing, discontinuous polygonal-shape (Cu, Ni)(6)Sn-5 intermetallic compounds (IMCs) formed at the interface. During reflowing for up to 60 min, the interfacial IMCs were sequentially changed in the following order: discontinuous (Cu, Ni)(6)Sn-5, (Cu, Ni)(6)Sn-5 and (Ni, Cu)(3)Sn-4, and embedded (Cu, Ni)(6)Sn-5 in (Ni, Cu)(3)Sn-4. The interfacial product variation resulted from the preferential consumption of Cu atoms within the solder and continuous Ni diffusion from the Ni(P) layer. (C) 2011 Elsevier B.V. All rights reserved.