From magic to technology: materials integration by wafer bonding
From magic to technology: materials integration by wafer bonding
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DOI：
10.1117/12.646450
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发表时间：
2006-02
期刊：
影响因子：
--
通讯作者：
V. Dragoi
中科院分区：
文献类型：
--
作者：
V. Dragoi
Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox. Different principles governing the wafer bonding processes will be reviewed in this paper. Various types of applications will be presented as examples.
