Use of a respirometer to measure oxidation rates of polymeric materials at ambient temperatures.

Use of a respirometer to measure oxidation rates of polymeric materials at ambient temperatures.
复制标题

使用呼吸计测量环境温度下聚合物材料的氧化速率。

DOI:
10.1016/j.polymer.2005.09.069
复制
发表时间:
2005
期刊:
影响因子:
4.6
通讯作者:
D. J. Harris
D. J. Harris
中科院分区:
化学2区
文献类型:
--
作者:
R. Assink;M. Celina;J. M. Skutnik;D. J. Harris

文献摘要

被引文献

相似文献

介绍了呼吸计作为一种测量热降解聚合物氧化速率的新技术。具有燃料电池检测器的双通道呼吸计显示出足够的灵敏度,可以在相对较短的时间内在环境温度下测量低密度聚合物样品的氧化速率。低密度聚氨酯泡沫样品在23至110°C的密封室中老化不同长度的时间。氧气消耗的程度是通过用空气冲洗腔室并将腔室流中的氧气浓度与参考流中的氧气浓度进行比较来测量的。在23℃条件下,在不到600h的老化时间内,可以测量到0.1g/cm3聚氨酯泡沫的氧化速率。这相当于大约2ppm的氧化重量。泡沫的氧化率被用来计算在很宽的温度范围内的加速因子,包括环境条件。在高温下测定了聚氨酯泡沫塑料压缩力的加速系数。假设泡沫压缩力的老化行为与其氧化速率相关,则可以计算压缩力的加速因子并预测泡沫在环境温度下的性能。
The use of a respirometer is introduced as a novel technique for measuring the oxidation rates of thermally degrading polymers. A dual channel respirometer with fuel cell detectors demonstrates sufficient sensitivity to measure the oxidation rates of low-density polymeric samples at ambient temperatures in a relatively short period of time. Samples of low-density polyurethane foam were aged for various lengths of time in sealed chambers at temperatures ranging from 23 to 110°C. The extent of oxygen depletion was measured by flushing the chamber with air and comparing the oxygen concentration in the chamber flow to that of a reference flow. Oxidation rates of the 0.1g/cm3polyurethane foam could be measured in less than 600h of aging time at 23°C. This corresponds to approximately 2ppm oxidation by weight. Oxidation rates of the foam were used to calculate acceleration factors over a wide temperature range, including ambient conditions. Acceleration factors for the compressive force of the polyurethane foam were determined at elevated temperatures. Assuming that the aging behavior of compressive force of the foam is correlated to its oxidation rate, it is possible to calculate acceleration factors for the compressive force and predict the performance of the foam at ambient temperatures.