Molten droplet solidification and substrate remelting in microcasting Part II: Parametric study and effect of dissimilar materials
Molten droplet solidification and substrate remelting in microcasting Part II: Parametric study and effect of dissimilar materials
复制标题
微铸造中熔滴凝固和基体重熔第二部分：异种材料的参数研究和影响
DOI：
10.1007/s002310050293
复制
发表时间：
1999
影响因子：
2.2
通讯作者：
C. Amon
中科院分区：
文献类型：
--
作者：
K. Schmaltz;L. J. Zarzalejo;C. Amon
本文对微铸造成形沉积制造（SDM）中的相关工艺参数进行了参数化研究。微铸造SDM是一种新型的分层制造工艺，能够快速制造近净形金属物体。用这种工艺制造的工件的质量取决于碰撞的熔融液滴和先前沉积的基底层之间的适当的化学键合，以及工件的最终微观结构。进行数值模拟，以研究操作条件对基板重熔引起的电弧键合和凝固过程中的冷却速率所确定的微观结构的影响。特别是，液滴撞击温度，基板的初始温度和铜和不锈钢材料的组合的影响进行了研究。数值预测表明，撞击液滴的温度变化，在可达到的范围内，在微铸造SDM，在凝固过程中的冷却速率有一个最小的影响。然而，熔滴温度对衬底重熔深度有显著影响。此外，这项调查量化的程度，基板预热降低凝固过程中的冷却速率，促进基板重熔。铜和不锈钢材料之间的相互作用的研究表明，在沉积材料的凝固过程中的冷却速率和基板重熔的发生都高度依赖于材料的组合。
This paper presents a parametric study of relevant processing parameters found in microcasting Shape Deposition Manufacturing (SDM). Microcasting SDM is a novel, layered manufacturing process capable of rapidly manufacturing near net shape, metal objects. The quality of artifacts built with this process depends on proper metallurgic bonding between impacting molten droplets and previously deposited substrate layers, as well as on the final microstructure of the artifact. Numerical simulations are performed to investigate the effect of operating conditions on the metallurgic bonding induced by substrate remelting and on the microstructure determined by the cooling rates during solidification. Particularly, the effect of droplet impinging temperatures, substrate initial temperatures and combinations of copper and stainless steel materials are investigated. Numerical predictions reveal that impinging droplet temperature variations, within the attainable range in microcasting SDM, have a minimal effect on the cooling rates during solidification. However, droplet temperature has a significant effect on the substrate remelting depth. Furthermore, this investigation quantifies the extent to which substrate preheating lowers the cooling rate during solidification and promotes substrate remelting. The study of the interaction between copper and stainless steel materials shows that the cooling rates during solidification of the deposition material and the occurrence of substrate remelting are both highly dependent on the combination of materials.