Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis
Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis
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DOI:
10.1007/s11664-014-2977-9
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发表时间:
2014-01
影响因子:
2.1
通讯作者:
S. F. Choudhury;L. Ladani
中科院分区:
文献类型:
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作者:
S. F. Choudhury;L. Ladani