The electrochemical study of a chromium plating bath. I. Reactions leading to solution-free species
The electrochemical study of a chromium plating bath. I. Reactions leading to solution-free species
复制标题
铬镀液的电化学研究。
DOI：
--
复制
发表时间：
1983
期刊：
影响因子：
--
通讯作者：
D. Pletcher
中科院分区：
文献类型：
--
作者：
Jiang Lin;D. Pletcher
重新研究了在标准铬电镀溶液（200 g dm-3 CrO 3和2 g dm-3 H2SO 4）中C、Cr、Cu和Ni阴极上发生的电极反应。本文着重研究那些导致无溶液产物的反应，这些反应发生在电位正的薄膜或金属沉积所需的。对于每个阴极，theI-E曲线示出了铬（VI）还原为铬（III）的波或峰，并且证明了该过程是质量传递控制的，显然是通过硫酸根离子向电极表面的传递。在Cr、Ni和Cu时，铬（VI）/铬（III）电偶的电势由去除绝缘氧化膜决定，该绝缘氧化膜在金属浸入浴中时自发形成。在某些条件下，还可以定义质子还原的良好形成的波。
The electrode reactions occurring at C, Cr, Cu and Ni cathodes in the standard electroplating solution for chromium, 200 g dm−3 CrO3 and 2 g dm−3 H2SO4, have been reinvestigated. This paper emphasises the study of those reactions which lead to solution-free products; these occur at potentials positive to that necessary for film or metal deposition. For each cathode, theI-E curve shows a wave or peak for the reduction of chromium (VI) to chromium(III) and it is demonstrated that this process is mass transport controlled, apparently by the transport of sulphate ions to the electrode surface. At Cr, Ni and Cu, the potential of the chromium(VI)/chromium(III) couple is determined by the removal of an insulating oxide film which forms spontaneously when the metal is immersed in the bath. In certain conditions it is also possible to define a well formed wave for proton reduction.