Nanomechanical property screening of combinatorial thin-film libraries by nanoindentation
Nanomechanical property screening of combinatorial thin-film libraries by nanoindentation
复制标题
通过纳米压痕筛选组合薄膜库的纳米力学性能
DOI：
10.1088/0957-0233/16/1/014
复制
发表时间：
2004
影响因子：
2.4
通讯作者：
T. Wyrobek
中科院分区：
文献类型：
--
作者：
O. Warren;T. Wyrobek
机械性能在组合材料科学专家目前正在研究的几种材料类别的选择标准列表中名列前茅。正在探索的材料系统通常采用沉积在晶圆基板上的组合薄膜库的形式。鉴于这种特殊的形式，机械性能测定的可能选择方法是纳米压痕法，这是一种目前在传统材料科学的薄膜领域中常见的定量小体积技术。虽然纳米压痕应用于组合材料科学是最近才出现的，但有证据表明，采用组合方法的研究人员的意识不断增强，包括第一篇出版物、两份已发表的专利申请以及过去一年中的许多会议演讲，引用纳米压痕作为高通量筛选机械性能（例如弹性模量和压痕硬度）的技术。本文的目的是概述纳米压痕在组合薄膜库的纳米力学性能筛选方面的现状。
Mechanical properties rank high on the list of selection criteria for several material classes currently under investigation by combinatorial materials science specialists. The material system being explored is often in the form of a combinatorial thin-film library deposited onto a wafer substrate. Given this particular format, the likely method of choice for mechanical property determination is nanoindentation, a quantitative small-volume technique now commonplace in the thin-film segment of traditional materials science. While the advent of nanoindentation applied to combinatorial materials science is recent, evidence of a growing awareness among researchers employing combinatorial methodologies include the first publication, two published patent applications and a number of conference presentations over the past year citing nanoindentation as the technique selected for high-throughput screening of mechanical properties such as elastic modulus and indentation hardness. The intent of this paper is to synopsize the current status of nanoindentation in terms of nanomechanical property screening of combinatorial thin-film libraries.