Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy
Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy
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DOI：
10.1016/j.jallcom.2009.03.017
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发表时间：
2009-07-29
影响因子：
6.2
通讯作者：
Yung, W. K. C.
中科院分区：
文献类型：
--
作者：
Das, S. K.;Sharif, A.;Yung, W. K. C.
在本研究中，单独添加相同量的Al和Cu的Sn-9 Zn共晶焊料合金，以调查第三元素添加对新开发的三元焊料合金的显微组织和机械性能以及热行为的影响。结果表明，Al和Cu均细化了钎料合金的组织，并与钎料合金形成了金属间化合物。新开发的三元Sn-9 Zn-X焊料合金的显微组织由细小的针状α-Zn相和分散在β-Sn基体中的部分金属间化合物组成。结果表明，由于第二相弥散强化机制，合金中的Al 6 Zn 3Sn IMC均匀分布在β-Sn相中，从而提高了合金的抗拉强度。相反，大花形Cu 6Sn 5和棒状Cu 5 Zn 8 IMC与母体β-Sn基体形成某种弱界面，导致抗拉强度降低。Sn-9 Zn-0.5Al三元钎料合金的显微硬度也高于Sn-9 Zn-0.5Cu合金。(C)2009爱思唯尔有限公司版权所有。
In the present study, a separate addition of the same amount of Al and Cu are added with the Sn-9Zn eutectic solder alloy to investigate the effect of a third element addition on the microstructural and mechanical properties as well as thermal behavior of the newly developed ternary solder alloys. The results indicate that both Al and Cu refine the microstructure and form intermetallic compounds with the eutectic solder alloy. The microstructures of the newly developed ternary Sn-9Zn-X solder alloys were composed of fine needle-like alpha-Zn phase with some IMC dispersed in the beta-Sn matrix. The relatively small and compact shaped Al6Zn3Sn IMC was found to be uniformly distributed in the beta-Sn phase which results in an increase in the tensile strength, due to the second phase dispersed strengthening mechanism. On the contrary, the large flower shaped Cu6Sn5 and rod shaped Cu5Zn8 IMC develops some sort of weak interface with the parent beta-Sn matrix results in a decrease in the tensile strength. The microhardness of the Sn-9Zn-0.5Al ternary solder alloys was also higher than that of the Sn-9Zn-0.5Cu alloy. (C) 2009 Elsevier B.V. All rights reserved.