Microwave modeling and parameter extraction method for multilayer on‐chip inductors
Microwave modeling and parameter extraction method for multilayer on‐chip inductors
复制标题
DOI：
10.1002/mmce.20678
复制
发表时间：
2013-05
期刊：
影响因子：
--
通讯作者：
Jianjun Gao;Chen-Chen Yang-Chen
中科院分区：
文献类型：
--
作者：
Jianjun Gao;Chen-Chen Yang-Chen
本文基于物理原理提出了一种新的三维多层片上电感等效电路模型。该模型由多个基本单元组成，并且分布式模型中的每个单元表示单个堆叠电感器。该模型还考虑了用于将测试焊盘连接到最低金属层的带有馈线的通孔的分布效应。研究了结合解析方法和经验优化过程的模型参数提取方法。在50 MHz至20 GHz的频率范围内，硅上六层金属片上电感的仿真结果与测量结果之间具有良好的一致性。© 2012 Wiley Periodicals，Inc. Int J RF and Microwave CAE，2013.
A new equivalent circuit model for 3D multilayer on‐chip inductors based on physical principles is presented in this article. The model consists of multiple elementary cells, and every cell in the distributed model represents a single stacked inductor. The model also takes into account the distributed effect of the via‐hole with feedline which is used to connect the test pad to the lowest mental layer. A parameter‐extraction approach for proposed model which combines the analytical approach and empirical optimization procedure is investigated. Good agreement is obtained between simulated and measured results for a six metal layers on‐chip inductor on silicon in the frequency range of 50 MHz to 20 GHz. © 2012 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2013.